• Multilevel Vertical Seismic Profile Tool (MultiVSP)
Multilevel Vertical Seismic Profile Tool (MultiVSP)
+

Product Details


Introduction

MultiVSP is the most cost effective digital multi‑level downhole seismic array for large size downhole seismic surveys available on the market. Large size downhole survey: Improved reservoir delineation, faults & pinch‑out detection, possible simultaneous 3D VSP and 3D surface seismic acquisition, applications to geological contexts such as overhangs, salt bodies, gas clouds. 4D survey: Improved reservoir imaging resolution (statically and dynamically). Improved Signal to Noise ratio and optimized repeatability to quantify time‑lapse changes in the reservoir. Monitoring of fluid interfaces variation. Applications to water‑flooding, gas injection, CO₂ sequestration.

Applications

  • Ultra High Productivity ‑ Up to 100 levels, run at 2 ms sampling rate, real‑time with short cycle times required by offshore surveys.
  • Unequalled high channel count compared with standard conveyance.
  • Use of the proprietary deployment system allows rapid system rig up and full system testing during deployment.
  • Unique bypass function can exclude a malfunction level and allows operation continued.
  • Fail safe anchoring arm design allows safe operation and retrieval in both cased hole and open hole.
  • MultiVSP system uses standard GeoVSP auxiliary tools such as Gamma Ray, CCL and Tension/Compression.

Specifications

Maximum Temperature

260°F (125°C) Long Time

300°F (150°C) 4 hours

320°F (160°C) 1 hour

Maximum Pressure 15000 psi (103 MPa)
Outside Diameter 3.5 in. (89 mm)
Maximum Hole Diameter

9.17 in. (233 mm) Standard Arms

14 in. (355 mm) Extended Arms

Length 17.3 in. (440 mm)
Weight 18.7 lbs. (8.5 kg)
Anchoring Ratio 4:1
Geophone Sensor SGO‑15HT
Number of Sensors per Axis 1
Telemetry Rate

2.5 Mbits/s on 23,000 ft. (7000 m) cable

Up to 4 Mbits/s on shorter cable

Σ/△ ADC Resolution 24 bits
Sample rate 0.25 ms, 0.5 ms, 1 ms, 2 ms and 4 ms
Bandwidth 1666 Hz Max @ 0.25 ms
Maximum Levels 100
Gain 20 dB, 40 dB
Instantaneous Dynamic Range 122 dB
Wireline Requirements 7‑Conductor Cable
Hole Type Open Hole/Cased Hole
Auxiliary Tools  
Tension Optional
Gamma Ray Optional
CCL Optional

Multilevel Vertical Seismic Profile Tool (MultiVSP)

MultiVSP is the most cost effective digital multi‑level downhole seismic array for large size downhole seismic surveys available on the market.

Keywords:


Product Inquiry

Note: Please provide your contact information, and our specialists will get in touch with you as soon as possible!

Submit